Global Substrate-Like-PCB Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. Substrate-Like-PCB is used as a medium between the PCB board and the device body. It reduces the number of connections and minimizes overall power consumption by efficiently transferring signals to connected components. The Substrate-Like-PCB market is expanding because of factors such as the rising demand for smart devices & electronic devices and growing awareness towards the application of Substrate-like-PCB.

According to INDIA CELLULAR AND ELECTRONICS ASSOCIATION (ICER) in 2021, India's electronics exports are rising rapidly and get doubled in the past five years. In 2019 the revenue generation reached to approximately USD 15 billion from the export of electronic devices. The source also states that major export items include smartphones with increased growth of about USD 3.8 billion in the last five years. Whereas rising advancement towards the automobile sector and growing R&D activities by market players create lucrative opportunities for the market. However higher set-up cost hampers the market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Substrate-Like-PCB Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. The Asia Pacific dominated the market in terms of revenue, owing to the increasing adoption of smartphones, growing adoption and demand for connectivity solutions, and rising penetration of internet users. Whereas the Asia Pacific is expected to grow significantly during the forecast period, owing to factors such as increasing rising growth activities by market players, and the shift of users from 3G to 4G & 5G technologies in the forecast period

Major market players included in this report are:

Kinsus Interconnect Technology Corp.

Ibiden Co.Ltd.

Compeq Manufacturing Co. Ltd.

Daeduck Electronics Co. Ltd.

Unimicron Technology Corporation

Zhen Ding Technology

TTM Technologies

Meiko Electronics

Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)

Korea Circuit

Recent Developments in the Market:

In January 2022, Simmtech, a South Korean manufacturer of PCBs and semiconductor packaging substrates, announced the near completion of its first large-scale PCB factory on an 18-acre site in Penang, Malaysia. The factory complements its existing PCB facilities in Southeast Asia, particularly in South Korea, Japan, and China. The factory produces the first packaging substrates for dynamic random-access memory (DRAM) / NAND memory chips, as well as High-Density Interconnect (HDI) PCBs for memory modules and Solid-State Drive (SSD) devices.
In January 2022, Austria Technologies & System technik AG announced the expansion of its manufacturing plant in Ansan, South Korea, which manufactures high-tech printed circuit boards for a wide range of medical applications. The expansion increased the floor space to nearly 8,000 square meters, upgraded the involved production equipment, and added systems such as multilayer flex presses, e-copper coating machines, and UV lasers, among others. The expansion ensures growth in the Southeast Asian medical device market, as vendors now have easier access to chips.
Global Substrate-Like-PCB Market Report Scope:

Historical Data: 2019-2020-2021

Base Year for Estimation: 2021

Forecast period: 2022-2029

Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends

Segments Covered: Application, Region

Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World

Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Application:

Consumer Electronics,

Automotive,

Communication

By Region:

North America

U.S.

Canada

Europe

UK

Germany

France

Spain

Italy

ROE

Asia Pacific

China

India

Japan

Australia

South Korea

RoAPAC

Latin America

Brazil

Mexico

Rest of the World