Global Memory Packaging Market to reach USD 34.3 billion by 2027Global Memory Packaging Market is valued at approximately USD 23.61 billion in 2020 and is anticipated to grow with a healthy growth rate of more than 5.5 % over the forecast period 2021-2027. Memory modules are made up of small semiconductor chips that need to be packaged in a way that allows them to be easily integrated into the rest of the system. To ensure that the modules perform properly, memory integrated circuits are placed according to specifications. Growing investments by several governments in semiconductor industry is propelling the market growth. For instance, to fund the second phase of the National IC Investment Fund 2030, the Chinese government raised between USD 23 and 30 billion. Also, the market's manufacturers are expanding their production facilities. In South Korea, for example, in May 2021, SK Hynix Inc. is increased its semiconductor packaging and inspection facility capacity. Such innovations are likely to help existing firms increase their opportunities while reducing competitors' advantages in the market under consideration. According to an article published by SK Hynix Inc., companies can no longer keep up with 3D NAND demand, and must expand their manufacturing capacity. In order to satisfy the increased demand, numerous corporations are expanding their manufacturing operations. Due to all of the above factors, the market may become highly competitive during the forecast period. However, harsh reliability requirements in the automotive environment may impede market growth over the forecast period of 2021-2027.

The regional analysis of the global Memory Packaging Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America, and Rest of the World (ROW). Asia Pacific is the leading region across the world in terms of market share due to rising investment in the semiconductor industry in the region. Whereas North America is also anticipated to exhibit the highest growth rate over the forecast period 2021-2027, due to the presence and availability of global brands across the region.

Major market player included in this report are:
Tianshui Huatian Technology Co. Ltd
Hana Micron Inc.
Lingsen precision industries Ltd
Formosa Advanced Technologies Co. Ltd
Advanced Semiconductor Engineering Inc.
Amkor Technology Inc.
Powertech Technology Inc.
Jiangsu Changjiang Electronics Technology Co. Ltd
Powertech Technology Inc.
King Yuan Electronics Corp. Ltd
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Platform:
Flip-chip
Lead-frame
Wafer-level Chip-scale Packaging(WLCSP)
Through-silicon Via (TSV)
Wire-bond
By Application:
NAND Flash Packaging
NOR Flash Packaging
DRAM Packaging
Other Applications
By End use:
IT and Telecom
Consumer Electronics
Automotive
Other End-user Industries
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year - 2017, 2018-19
Base year - 2019-2020
Forecast period - 2021 to 2027.

Target Audience of the Global Memory Packaging Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors