Global Outsourced semiconductor assembly and testing Market to reach USD 49.2 billion by 2027
Global Outsourced semiconductor assembly and testing Market is valued at approximately USD 34.7 Billion in 2020 and is anticipated to grow with a healthy growth rate of more than 5.1 % over the forecast period 2021-2027. Outsourced semiconductor assembly and test (OSAT) are the companies offering third-party IC-packaging and test services. The companies provide packaging to silicon device, made by foundries and test devices before shipping to the market. The companies operating in the market provide advanced and pocket friendly solutions that offer processing-speeds, higher performance, and functionality with occupying less space in electronic devices. Increase in demand for consumer electronics is expected to fuel the Outsourced semiconductor assembly and testing Market. Surge in degree of urbanization across the globe is also propelling the market growth. For instance, in June 2020, Taiwanese majors ASE Technology Holding confirmed that it planned to set up its manufacturing units in India to develop export hubs to undertake outsourced semiconductors packaging and test services. Moreover, several key players are taking strategic initiatives to expand their presence in the market for instance
In April, 2021, Jiangsu Chanjiang Electronics Technology Co., Ltd, launched Automotive Electronics Business Centre, aiming to leverage the industrial clustering effects of Zhangjiang Science City to strengthen JCET's services to its customers throughout the product life cycle.
In February, 2021, Siemen Digital Industries collaborated with Advanced Semiconductor Engineering Inc. (ASE) to help mutual customers, in creating and evaluating multiple complex integrated circuit package assemblies and interconnected scenarios.

However, high cost associated with OSAT companies may impede market growth over the forecast period of 2021-2027.

The regional analysis of the global Outsourced semiconductor assembly and testing Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America, and Rest of the World (ROW). Asia-Pacific is expected to show the fastest growth in the forecast period in OSAT market in terms of revenue. Surge in trend in the global automotive sector for advanced semiconductor chip package solutions is estimated to boost the growth of the market in the region. North America is likely to be following Asia-Pacific and be second largest growing market as it has generated highest revenue in 2020.


Major market player included in this report are:

Jiangsu Changjiang Electronics Technology Co. Ltd
Powertech Technology Inc.
Tianshui Huatian technology Co Ltd
Amkor Technology Inc.
Advanced Semiconductor Engineering Inc
ASE technology Holding Co., Ltd
TongFu Microelectronics Co. Ltd
King Yuan Electronics Corp.
Unisem Group
Hana Micron Inc.

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Service Type:
Testing
Assembly

By Packaging Type:
Ball Grid Array
Chip Scale Package
Multi Package
Stacked Die
Quad & Dual

By Application:
Automotive
Consumer Electronic
Industrial
Telecommunication
Others

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year - 2017, 2018-19
Base year - 2019-2020
Forecast period - 2021 to 2027.

Target Audience of the Global Outsourced semiconductor assembly and testing Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors