Global Wafer Backgrinding Tape Market is valued approximately USD 201.6 million in 2020 and is anticipated to grow with a healthy growth rate of more than 4.5 % over the forecast period 2021-2027. Wafer backgrinding is a semiconductor device fabrication technique that reduces wafer thickness to facilitate integrated circuit stacking and high-density packing. ICs are made on semiconductor wafers, which go through a series of processing stages. It is the process of grinding the backside of the wafer to the proper thickness before assembly. The global wafer backgrinding market is primarily driven by increased demand for wafer manufacture, increased focus on wafer surface protection during the grinding process, and growth in the semiconductor sector. For instance, LINTEC Corporation introduced the Back Grinding Tape Laminator "RAD-3520F/12" in April 2017 to protect the circuit surface of the wafer during back grinding. However, the market is projected to be restrained by the change from non-UV to UV curable backgrinding tapes, which raises the entire cost of wafer fabrication.

The key regions considered for the global Wafer Backgrinding Tape market study includes Asia Pacific, North America, Europe, Latin America and Rest of the World. Asia Pacific is the leading/significant region across the world in terms of market share owing to the wafer fabrication demand is increasing, as is the focus on wafer surface protection during the grinding process, and the semiconductor industry is expanding. Whereas, Asia-Pacific is also anticipated to exhibit highest growth rate / CAGR over the forecast period 2021-2027.

Major market player included in this report are:

AI Technology Inc.

AMC Co. Ltd.

Denka Company Limited

Furukawa Electric Co. Ltd.

Force-One Applied Materials

Lintec of America Inc. (Lintec Corporation)

Mitsui Chemicals Inc.

Nitto Denko Corporation

Pantech Tape Co. Ltd.

Minitron Elektronik GmbH

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type:

UV Curable

Non-UV

By Wafer Size:

6-Inch

8-Inch

12-Inch

Others

By Region:

North America

U.S.

Canada

Europe

UK

Germany

France

Spain

Italy

ROE

Asia Pacific

China

India

Japan

Australia

South Korea

RoAPAC

Latin America

Brazil

Mexico

Rest of the World

Furthermore, years considered for the study are as follows:

Historical year - 2018, 2019

Base year - 2020

Forecast period - 2021 to 2027

Target Audience of the Global Wafer Backgrinding Tape Market in Market Study:

Key Consulting Companies & Advisors

Large, medium-sized, and small enterprises

Venture capitalists

Value-Added Resellers (VARs)

Third-party knowledge providers

Investment bankers

Investors