Table of Contents
Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2029 (USD Billion)
1.2.1. Ball Grid Array (BGA) Packaging Market, by Region, 2019-2029 (USD Billion)
1.2.2. Ball Grid Array (BGA) Packaging Market, by Material Type, 2019-2029 (USD Billion)
1.2.3. Ball Grid Array (BGA) Packaging Market, by Type, 2019-2029 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Ball Grid Array (BGA) Packaging Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Ball Grid Array (BGA) Packaging Market Dynamics
3.1. Ball Grid Array (BGA) Packaging Market Impact Analysis (2019-2029)
3.1.1. Market Drivers
3.1.1.1. Rising Automotive Industry
3.1.1.2. Growing Demand for Consumer Electronics
3.1.2. Market Challenges
3.1.2.1. Lack of Skilled Workforce
3.1.3. Market Opportunities
3.1.3.1. Technological Advancements
Chapter 4. Global Ball Grid Array (BGA) Packaging Market Industry Analysis
4.1. Porter's 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.2. Futuristic Approach to Porter's 5 Force Model (2019-2029)
4.3. PEST Analysis
4.3.1. Political
4.3.2. Economical
4.3.3. Social
4.3.4. Technological
4.4. Top investment opportunity
4.5. Top winning strategies
4.6. Industry Experts Prospective
4.7. Analyst Recommendation & Conclusion
Chapter 5. Risk Assessment: COVID-19 Impact
5.1. Assessment of the overall impact of COVID-19 on the industry
5.2. Pre COVID-19 and post COVID-19 Market scenario
Chapter 6. Global Ball Grid Array (BGA) Packaging Market, by Material Type
6.1. Market Snapshot
6.2. Global Ball Grid Array (BGA) Packaging Market by Material Type, Performance - Potential Analysis
6.3. Global Ball Grid Array (BGA) Packaging Market Estimates & Forecasts by Material Type 2019-2029 (USD Billion)
6.4. Ball Grid Array (BGA) Packaging Market, Sub Segment Analysis
6.4.1. Ceramic/ (CBGA)
6.4.2. Plastic/ (PBGA)
6.4.3. Tape/ (TBGA)
Chapter 7. Global Ball Grid Array (BGA) Packaging Market, by Type
7.1. Market Snapshot
7.2. Global Ball Grid Array (BGA) Packaging Market by Type, Performance - Potential Analysis
7.3. Global Ball Grid Array (BGA) Packaging Market Estimates & Forecasts by Type 2019-2029 (USD Billion)
7.4. Ball Grid Array (BGA) Packaging Market, Sub Segment Analysis
7.4.1. Molded Array Process BGA
7.4.2. Thermally Enhanced BGA
7.4.3. Package on Package (PoP) BGA
7.4.4. Micro BGA
Chapter 8. Global Ball Grid Array (BGA) Packaging Market, Regional Analysis
8.1. Ball Grid Array (BGA) Packaging Market, Regional Market Snapshot
8.2. North America Ball Grid Array (BGA) Packaging Market
8.2.1. U.S. Ball Grid Array (BGA) Packaging Market
8.2.1.1. Material Type breakdown estimates & forecasts, 2019-2029
8.2.1.2. Type breakdown estimates & forecasts, 2019-2029
8.2.2. Canada Ball Grid Array (BGA) Packaging Market
8.3. Europe Ball Grid Array (BGA) Packaging Market Snapshot
8.3.1. U.K. Ball Grid Array (BGA) Packaging Market
8.3.2. Germany Ball Grid Array (BGA) Packaging Market
8.3.3. France Ball Grid Array (BGA) Packaging Market
8.3.4. Spain Ball Grid Array (BGA) Packaging Market
8.3.5. Italy Ball Grid Array (BGA) Packaging Market
8.3.6. Rest of Europe Ball Grid Array (BGA) Packaging Market
8.4. Asia-Pacific Ball Grid Array (BGA) Packaging Market Snapshot
8.4.1. China Ball Grid Array (BGA) Packaging Market
8.4.2. India Ball Grid Array (BGA) Packaging Market
8.4.3. Japan Ball Grid Array (BGA) Packaging Market
8.4.4. Australia Ball Grid Array (BGA) Packaging Market
8.4.5. South Korea Ball Grid Array (BGA) Packaging Market
8.4.6. Rest of Asia Pacific Ball Grid Array (BGA) Packaging Market
8.5. Latin America Ball Grid Array (BGA) Packaging Market Snapshot
8.5.1. Brazil Ball Grid Array (BGA) Packaging Market
8.5.2. Mexico Ball Grid Array (BGA) Packaging Market
8.5.3. Rest of Latin America Ball Grid Array (BGA) Packaging Market
8.6. Rest of The World Ball Grid Array (BGA) Packaging Market
Chapter 9. Competitive Intelligence
9.1. Top Market Strategies
9.2. Company Profiles
9.2.1. Amkor Technology
9.2.1.1. Key Information
9.2.1.2. Overview
9.2.1.3. Financial (Subject to Data Availability)
9.2.1.4. Product Summary
9.2.1.5. Recent Developments
9.2.2. TriQuint Semiconductor Inc.
9.2.3. Jiangsu Changjiang Electronics Technology
9.2.4. Corintech Ltd.
9.2.5. STATS ChipPAC
9.2.6. ASE Technology Holding
9.2.7. Integrated Circuit Engineering Corp.
9.2.8. Cypress Semiconductor Corp.
9.2.9. Infineon Technologies AG
9.2.10. NXP Semiconductors NV
Chapter 10. Research Process
10.1. Research Process
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.2. Research Attributes
10.3. Research Assumption